@article{Müller2015,
title = {Resistive power loss analysis of PV modules made from halved 15.6×15.6cm² silicon PERC solar cells with efficiencies up to 20.0%},
author = {J Müller and D Hinken and S Blankemeyer and H Kohlenberg and U Sonntag and K Bothe and T Dullweber and M Köntges and R Brendel},
doi = {10.1109/JPHOTOV.2014.2367868},
year = {2015},
date = {2015-01-01},
journal = {IEEE Journal of Photovoltaics},
volume = {5},
number = {1},
pages = {189-194},
keywords = {device simulation, Integrated circuit interconnections, Laser beam cutting, module interconnection passivated emitter and rear cell (PERC) solar cells, Photovoltaic cells, Photovoltaic systems, Resistance, resistive power loss, silicon},
pubstate = {published},
tppubtype = {article}
}

@inproceedings{Petermann2013,
title = {Module interconnection of both sides-contacted silicon solar cells by screen-printing},
author = {J H Petermann and H Schulte-Huxel and V Steckenreiter and R Gogolin and S Eidelloth and T Dullweber and S Kajari-Schröder and R Brendel},
editor = {IEEE},
doi = {10.1109/PVSC.2013.6745190},
isbn = {978-1-4799-3299-3},
year = {2013},
date = {2013-06-16},
booktitle = {2013 IEEE 39th Photovoltaic Specialists Conference (PVSC) },
journal = {Proceedings of the 39th IEEE Photovoltaic Specialists Conference},
pages = {3448-3453},
address = {Tampa, FL, USA},
keywords = {Glass, heterojunction, Hybrid silicon, Integrated circuit interconnections, Lasers, module interconnection, module level processing, passivation, Photovoltaic cells, Resistance, screen-printing, silicon},
pubstate = {published},
tppubtype = {inproceedings}
}